Automated Optical Inspection Machine
High-precision AOI system designed for automated inspection of tray-loaded components with maximum throughput and consistent quality.
Operators load trays containing components with upward-facing spheres into the feed area (up to 20 trays). The system automatically picks trays, moves them to the inspection zone, and performs full-surface optical checks.
Inspection results include: Pass, Oversized Sphere, Undersized Sphere, Solder Bridges, Missing Balls, Solder Loss, Multiple Balls, Misaligned Balls. Defective parts are automatically separated into dedicated collection bins, while good components are replenished and placed into finished tray stacks.
System Overview
This fully automated AOI machine integrates tray handling, optical inspection, defect sorting, and replenishment into a single workflow. It is suitable for high-mix, high-volume environments where repeatable inspection and precise defect classification are critical.
Supported component sizes range from 0402 to 315-ball LPDDR components. The modular design allows easy adaptation for different tray types and product geometries.
Key Features
- Automatic tray picking and placement for up to 20 trays
- High-resolution CCD vision for top and bottom surface inspection
- Defect sorting with automatic separation into bins
- Replenishment of good components into trays after inspection
- Fully systemized operation for consistent throughput and accuracy
- Customizable workflow and inspection criteria according to customer needs
Technical Specifications
| Machine Dimensions (L × W × H) | 1200 × 1000 × 1800 mm |
| Motion & Drive | Servo motors, stepper motors, precision linear modules |
| Control System | Panasonic PLC with Weinview HMI |
| Vision System | High-resolution CCD cameras for top & bottom inspection |
| Electrical Components | Mean Well DC power, CHINT safety devices, AC contactors |
| Mechanical & Tooling | Ball screw modules, in-house machined parts, custom tooling trays |
Applications & Case Studies
Widely used in semiconductor packaging, LPDDR testing, IC component assembly, and high-mix electronics production.
Successfully implemented in EMS factories and IC tray handling lines across Asia and Europe, helping customers reduce inspection errors, improve throughput, and maintain traceable quality records.
Supports inspection of components ranging from 0402 chips to 315-ball LPDDR balls, with optional customizable defect criteria based on production requirements.
Engineering Philosophy
Built for accuracy, efficiency, and repeatability, the system combines automated tray handling, dual-surface CCD inspection, and precise defect sorting in a single workflow. Modular design ensures easy maintenance and scalable upgrades for future production needs.