Automated solder removal designed for stability and repeatable performance
This automatic solder removal machine is developed for manufacturers requiring
stable thermal control, consistent solder cleaning quality, and reliable continuous operation
in electronic component processing environments.
By integrating dual vibration feeding, adjustable dual-channel heating control,
and synchronized solder removal mechanisms, the system ensures efficient
solder cleaning while maintaining process stability and product integrity.
The system is suitable for automated solder removal applications where controlled
temperature profiles and uniform processing are critical.
- Electronic component rework and refurbishment
- Lead and pin solder removal processes
- High-volume production lines requiring stable solder cleaning
- Customized solder removal solutions for special components
Components are fed automatically via a dual vibration bowl system,
effectively filtering oversized parts before entering the processing stage.
The machine features dual tracks (Channel A and Channel B),
each with independently adjustable temperature zones.
Both heating stages can be precisely configured according to process requirements.
A time-controlled pusher mechanism ensures consistent material feeding,
while the solder removal unit performs simultaneous sweeping for uniform solder cleaning.
| Feeding System | Dual vibration bowl feeding |
| Heating Channels | Dual-track (A / B) with independent temperature control |
| Temperature Zones | Two-stage adjustable heating zones |
| Operation Mode | Fully automated system operation |
| Machine Dimensions (L×W×H) | 1900 × 1170 × 1900 mm |
| Motor Configuration | Servo motor / speed-controlled motor / stepper motor |
| Linear System | Ball screw & linear guide (HIWIN / TBI) |
| Control System | Panasonic PLC with Weilun HMI |
| Power Supply | Mean Well DC power supply with Chint leakage protection |
| Machined Parts | In-house machining + custom fixture trays |
The system is engineered with a clear design philosophy:
process control and reliability come before speed.
Every module—from feeding and heating to solder removal and control—
is selected and integrated to ensure long-term stability,
ease of maintenance, and consistent performance in real production environments.