128-Site Automated Test System

Ultra-high capacity automated IC/component testing platform, engineered for maximum throughput, accuracy, and efficiency in mass production environments.

This system supports trays of ICs loaded into the feeder station, enabling automatic tray exchange, stacking, and sorting of pass/fail components. Compatible with LPDDR200, 221, 254, and 315-ball ICs. Test duration is fully adjustable, and automated communication ensures seamless operation. Switching product series is as simple as changing the corresponding test fixture.

Fully systemized and modular, the platform can be customized for your testing software and production requirements, with optional software packages available for integration.

System Overview

The 128-site automated test system is designed for **high-volume production lines** requiring minimal downtime and maximum accuracy. Each tray of components undergoes multi-site testing, with automatic segregation of good and defective units. Tray handling, exchange, and stacking are fully automated to maintain continuous operation.

By combining modular hardware with advanced CCD vision systems, the platform delivers **repeatable, reliable results**, even in complex IC inspection scenarios.

Key Advantages

• Ultra-high throughput with 128 simultaneous test sites
• Automatic tray exchange, stacking, and sorting for zero manual errors
• Supports LPDDR and other high-pin-count ICs with flexible fixture design
• Adjustable test timing and automated software communication
• Fully modular and customizable for various production and testing needs
• CCD vision system ensures orientation recognition and defect detection for each component
• Optional integration with customer-provided software or proprietary software package

Application Cases

The 128-Site Automated Test System has been successfully implemented in:

• Mobile memory IC production lines (LPDDR200 / 221 / 254 / 315 balls)
• High-volume consumer electronics IC testing centers
• Automotive electronics component inspection facilities
• Semiconductor packaging and assembly plants requiring ultra-precision quality control

Customers have reported **over 98% yield accuracy**, **significant labor reduction**, and **increased throughput by 2–3x** compared to conventional test systems.

Technical Specifications

Engineering Philosophy

Built for ultra-high efficiency, accuracy, and reliability, the 128-Site Automated Test System ensures continuous, repeatable performance for high-volume IC testing. Modular design and standardized components allow easy maintenance and global deployment.

This system represents the pinnacle of SMT test automation, delivering measurable improvements in yield, labor reduction, and operational efficiency.